Electronics Forum | Thu Nov 08 21:46:09 EST 2007 | davef
In the marketing description of your paste, look for "percent metal by volume." This percent metal by volume figure gives you a good approximation of the amount of metal in each solder paste brick that you print on your board. In most solder paste fo
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Mon Oct 15 11:03:24 EDT 2001 | mikecampbell
Dave, Thanks for the info! Yes, I have read the IBM document and realized that I was missinformed about the paste volume. I need 5000 to 5600 cubic mils of paste. Running the numbers I get a 32 mil aperture with a 7 mil step (the rest of the board
Electronics Forum | Wed Sep 01 06:18:05 EDT 2010 | grahamcooper22
Dear SMT Manufacturer, As moisture is eliminated as the cause then solder paste volume will probably be the main contributing factor. More paste means more chance of solder balls and more flux fumes that need to be evaporated to reduce voiding. Even
Electronics Forum | Mon Jul 26 11:01:35 EDT 1999 | Kevin Hussey
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | I ha
Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev
Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo
Electronics Forum | Sat Jun 23 11:41:34 EDT 2007 | grantp
Hi, We use 1:1 for 1 mm BGA and it works fine. We used it at 4 thou laser cut stencils when we had a manual stencil printer, but have moved to 5 thou with the DEK and it works ok. We originally went to 4 thou because of paste release, but the DEK
Electronics Forum | Fri Mar 20 10:27:58 EDT 2009 | joelperez
Hello, Has anyone dealt with the process of listing the substances on their electronic products due to REACH? I'm trying to find out if there is a way to globally calculate the area ratio of all the apertures on a solder paste stencil so I can calcu
Electronics Forum | Fri Oct 31 14:09:07 EDT 2014 | wbrenner
Having a problem with a DEK printer. In the back to front motion, getting poor ramdom paste volume on micro BGA pads. Other BGA 1 mm pads are fine. The front to back motion is fine. Any throufghts on this directional issue. Ran ~200 panels no pr
Electronics Forum | Wed Jan 20 07:31:58 EST 2021 | denism
Hi, Option 3 is quite often used, while it is better to glue with uv glue using uv lamps for curing. For this process, two inverters are needed in the line, a dispenser for UV glue and a UV lamp (eg metronelec UV CURE OVEN). It is better to use prefo
