Electronics Forum: patern (Page 1 of 1)

Flip Chip Underfil process

Electronics Forum | Thu Jun 26 08:49:21 EDT 2003 | caldon

Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue?? Here is a good paper from Asymtek that was poster in Advan

Best solder paste printer with solder paste inspection and AOI function-Recomendation

Electronics Forum | Wed May 25 19:25:24 EDT 2022 | jojoled

Thanks "Spoiltforchoice" for Informations, I have found allready a Chinese company which has such machines, just wanted to check other options from other countries too. I know it is from other end of linear process, but from my point of view (plus wh

Universal Instruments PPU Transferring programs?

Electronics Forum | Fri Aug 27 12:00:54 EDT 2004 | pemnut

Looking in My book, it describes "E" in the last data field as follows. Load error. This function code is not programmed as part of a pattern step. The controller uses the E code as an error marker. While a pattern program is being loaded into memory

Best solder paste printer with solder paste inspection and AOI function-Recomendation

Electronics Forum | Thu May 26 07:53:42 EDT 2022 | jojoled

Hi.Thanks for reply. 1. - I guess after JETting the paste, the head will go aside, to allow head with HD camera(SPI) to do the job.....and thus if used for AOI , the same camera will be much higher above components, not damaging anything....this is

Re: Thanks.

Electronics Forum | Fri Jun 04 17:26:11 EDT 1999 | C.K.

| | | | Geez, those test guys are always whining about via holes, aren't they? I even had one test guy go over to our finals/add-on department and instruct everone to look for unfilled vias and fill them by hand! Without consulting the area manage

Re: Thanks.

Electronics Forum | Mon Jun 07 11:10:56 EDT 1999 | Brian Wycoff

| | | | | | | Geez, those test guys are always whining about via holes, aren't they? I even had one test guy go over to our finals/add-on department and instruct everone to look for unfilled vias and fill them by hand! Without consulting the area

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