Electronics Forum | Mon Jan 09 09:11:12 EST 2006 | russ
I'm really wondering about the gloves and wipes. We also reclaim all metal and get paid but, we have to pay for the jars, wipes, tubes, etc... We always come out $ ahead so I'm really more curious than anything.
Electronics Forum | Wed Feb 16 12:34:49 EST 2005 | greg
Hi all We recently have a problem with component in package 0805 (capasitor 100nF). I have noticed that after reflow soldering only one lead of the component is soldered. The second one is just laying on the PCB land. We use screen printing process
Electronics Forum | Wed Feb 16 17:28:14 EST 2005 | davef
Greg: As we understand it, in your situation: * One 0805 lead solders to board properly * Another 0805 lead does not solder On the 0805 lead does not solder, there does the solder go? * On the pad * On the component lead A common solderability test
Electronics Forum | Thu Jan 05 17:35:36 EST 2006 | russ
"And don't look for logic or consistancy in polital matters". No kidding? I am having a hard time trying to figure out how you go about determining your levels of waste and also where to find "hazardous material" classifications for my area. I am
Electronics Forum | Tue Jul 14 18:42:41 EDT 2009 | anndi
1smtdude, I interested in your explaination of > re-work an underfill part. You mention the > material can be heated to a plastic state to > become vicious... do you know usually what range > is the temperate? (guess it can depend on the > type
Electronics Forum | Tue May 02 07:56:58 EDT 2006 | billyd
Yeah, that's what I'm doing now. I have it now peaking around 235, with about 70 sec. above 220C. (220C is the reflow temp, according to manufacturer. I've always used 217C for Pb free) Wish me luck. Thanks!
Electronics Forum | Tue May 02 07:46:39 EDT 2006 | Bob R.
Be careful about taking any generic advice and trying to use it to reduce voiding for your particular paste with your particular boards. I've done a few literature searches over the years on causes/cures for BGA voiding in the SnPb world and found a
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Tue May 02 07:19:29 EDT 2006 | billyd
Good morning all. I'm trying to find some help on my voiding issue on my lead free BGAs. I am using a Heller 8/2 zone oven, and using Qualitek solder paste. I had listened to a tech representing another solder company, who told me to make the joints
