Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef
What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board
Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Wed Oct 25 10:33:08 EDT 2000 | Chris
I need to know the advantages or disavantages of a plastic or FR4/Flex based BGA over the ceramic based BGA. We have a BGA package we are going to have produced. Some want to have it made out of ceramic because they feel a ceramic package will be a
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
Electronics Forum | Mon Oct 24 01:47:36 EDT 2005 | hcl
We are considering MY-9 AND YAMAHA YV 100XG. WHETHER YV100XG CAN PLACE O201 AND 01005? WHAT IS THE CAPABILITIES OF PLACEING BGA/CSP ETC.,
Electronics Forum | Thu May 28 22:02:09 EDT 1998 | Ian Bates
Jerry, I have been using the QP in a Proto and Production environment for about a Year and once the PD is Created(which may take some time) and vision processes. I rarely ever need to make further changes. As far as BGA Pd's. They are a Little
Electronics Forum | Tue May 02 23:34:26 EDT 2006 | Frank
The 2060RE model that I have can do an 18"x20" board. I think the Mydata can do larger. Juki did tell me that next year they will release a machine that will do larger boards but didn't specify on how big. The 2060RE can do 0201 up to 74mm square
Electronics Forum | Thu Jul 25 08:58:22 EDT 2019 | Matt
Hey all, i'm hoping to get some feedback from the community on baking process versus a dry box. current process we have for rework of PCBs is to perform a 16 hour bake cycle on hardware before BGA rework is performed. however this process is ineffi
Electronics Forum | Wed Apr 25 23:26:50 EDT 2001 | Ivan Rojas
Well Joe , I have work with Mydata for 3 years and 2 years for Siplace ,,, both they have great qualities different from eachother . One of the biggest different that I can said is the software of Mydata , is so much user friendly you can do thing r
winsouce.jpg)
.gif)