Electronics Forum | Wed Jan 02 13:31:55 EST 2002 | PeteC
The rule-of-thumb is to follow the flux mfg.'s recommended profile to achieve their specified top side PCB temperature before making contact with the wave. Typical top side PCB temps are 100-120deg.C. Your wave contact time should be around 2 seconds
Electronics Forum | Wed Jan 09 17:14:48 EST 2002 | mregalia
Do you bond with Al or gold wire? What happens if the Ni is over 150 microinches? Thickness of nickel is one those things that we have not been consistent with. The industry seems to pretty much universally call for 100-200 microinches. Our old board
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Wed Apr 10 11:46:28 EDT 2002 | mlovett
I would like to know the Stated Specification for PTH size tolerances. Or is there a generalised acceptable limit?. We have some PCB's with hole sizes that I consider to be way off what I would deem acceptable, ie Finished hole size should be 0.89mm
Electronics Forum | Mon May 06 10:55:30 EDT 2002 | Eric Miller
I am looking for anyone who may have information > on adjustable reflow pallets. Could you please > provide a supplier and contact. My dilema is that > during an initial NPI build the PCB's may not > arrive with rail adds. I need a way to transfe
Electronics Forum | Mon Apr 29 02:50:03 EDT 2002 | Bob Willis
The basic guidline is lead size plus 0.010" which you can also use for through hole reflow/intrusive reflow. Most suppliers of the insertion equipment quote this as the minimum clearance hence its a good guide. Druing recent trials for through hole
Electronics Forum | Tue May 07 07:38:13 EDT 2002 | ianchan
Hi mate, checked with one of our egg-brains in the factory (freakin' workaholic still around at this time of night), he tells me that Ag-based PCB finishings share rather similar reflow temperatures for normal Sn/Pb applications. this means (if he i
Electronics Forum | Mon May 13 16:20:10 EDT 2002 | ian
Are you refering to MacDermid Sterling Silver finish or immersion silver in general. We have had enquiries about Sterling Silver from a customer and the blurb I have read looks very good (don't most sales literature). Has anyone tried this finish? O
Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg
What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often
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