Electronics Forum | Tue Oct 17 18:27:21 EDT 2000 | Philip Reyes
Hello fellows, Can you clear me up regarding the reballing of Plastic BGA? Is it necessary to reball plastic BGA module if you have missing ball defect? What is the alternative process for rework? Do i need to flip the module then apply paste on
Electronics Forum | Wed Oct 11 09:23:06 EDT 2000 | Roger Squires
Has anyone had any success in finding open circuits (i.e. ball present but not soldered to PCB) under collapsible BGA's using an Agilent HP5DX x-ray tester and the BGA2 algorithm? Can anyone recommend an elongated pad design which produces the neces
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg
I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this
Electronics Forum | Mon Oct 02 11:20:44 EDT 2000 | aaronho
It's not really you need a book. You can ask your stencil supplier for what to... The supplier should be an expert in stencil making. Basically pitches and apertures should be made to the spec in CAD data of PCB. You can ask to make to 90% size of pa
Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder
I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil
Electronics Forum | Thu Sep 21 17:50:43 EDT 2000 | Bill Boles
Does anyone have a quick reminder for a PCB with immersion gold surface finnish going through a reflow profile: Which of the following statements is more correct? A: In order to minimize gold in the intermetallics of the solder joint, the board temp
Electronics Forum | Mon Jan 22 11:35:16 EST 2001 | kirks
Hey Mike, what do you recommend for PCB cleaning if there was a mis-print during the screen printing process. Currently we are hand cleaning them with a SMT solution but are having problems with solder balls in the via's and joints. What cleaning mat
Electronics Forum | Wed Sep 13 20:58:50 EDT 2000 | Dave F
If you don't know what you have, how the blank are we sposed to tell you? Try your local fab. CEM1 - Opaque tan CEM3 - Translucent FR2 - Opaque brown FR3 - Opaque cream FR4 - Translucent FR5 - Translucent FR6 - Opaque white G10 - Translucent G11 -
Electronics Forum | Thu Sep 14 09:53:09 EDT 2000 | John Thorup
Cheap and beige = CEM1 Dave has good advice. Go to a fab that you use and ask them. My concern is that you are not getting enough documentation to do your job correctly. If your customer expects you to duplicate a sample they had better spec what th
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