Electronics Forum | Fri Dec 04 05:47:57 EST 2015 | rushpcbuk
In PCB design, a BGA (Ball Grid Array) package typically determines the number of layers that a Printed Circuit Board should have. However, the 4-layer board with a BGA package is commonly used than a 2-layer than an 8-layer PCB. On the other hand, t
Electronics Forum | Thu Nov 20 03:58:39 EST 2014 | hhat
To get the best performance of electronic circuits, components and circuit board supports circuit components and devices in electronic products. Even if the circuit principle diagram design is correct, the printed circuit board is designed improperly
Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr
Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads
Electronics Forum | Tue Feb 16 13:57:50 EST 1999 | Ron Beasley
| | I have a recent design (1 component side only) that calls for 2 surface mounted antenna's (brass plated) to be mounted on a PCB. The problem arises when the PCB is 18x11.25 and has 15 to 20 PCB's in the pallet (IE weight, fixturing to hold the a
Electronics Forum | Tue Jun 05 12:12:19 EDT 2007 | SWAG
We do not recommend array sizes. PCB houses take a single board and turn it into a step/repeat that is best fit for their process = cheaper boards I suppose. We then approve this array and build programs and tooling to match. On occasion, we recei
Electronics Forum | Tue Jun 05 15:10:24 EDT 2007 | jax
Am I missing something? Get the Laminate Sizes from your suppliers, and make your own Array Files. You might need to include tooling holes for the Fabrication house but they will surely supply you with the information that they need. This way you
Electronics Forum | Wed Jun 06 09:29:33 EDT 2007 | SWAG
An example would be great, Hussman. Please send to sketest@skecorp.com if you have the time. We have something like it but maybe yours has things we didn't think of. I agree with doing our own array designs - that would be great but we are low on
Electronics Forum | Fri May 20 03:41:04 EDT 2016 | jpcwg
With power components coming in smaller and smaller surface mount packages it is very important to come up with a coherent approach to mitigating the thermal dissipation requirements of these components in a PCB design. While the development of an ex
Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis
| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t
Electronics Forum | Mon Nov 20 10:40:35 EST 2006 | SWAG
Thanks Mark and Dave. It sounds like our board design and problem areas are similar to yours, Mark. We talked with our customer about the grid pattern but I'm not sure where we are at with that. In reference to the Tg/Td thread, the material is a
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