Electronics Forum | Sun Nov 19 22:21:37 EST 2006 | KEN
When you say "SMD" I am assuming you are refering to a component. But in your description you mention these are some type of "boards". "flatness" or coplanarity is a function of the application and process. I think in your case your standards wo
Electronics Forum | Fri Nov 17 14:36:17 EST 2006 | Fer
Good afternoon all, There is an issue in my company regarding flatness on SMDs. The part I am fabricating is a multilayer assembly of .175" by .175" by .049" thick. The part is made out of a multilayer copper clad PTFE with a tin finish surface. Af
Electronics Forum | Mon Nov 20 19:49:03 EST 2006 | davef
Sorry for stating this incorrectly. It should been: Bow & twist for bare boards and panels: IPC-A-610 Acceptability of Electronic Assemblies, 10.6: 1.5% for PTH only and 0.75% for SMT, acording to test method TM-650, method 2.4.22 IPC-6012, par. 3.
Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef
The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking
Electronics Forum | Sun Apr 21 19:56:57 EDT 2002 | francis khoo
Hello Pete, Very true about the heel fillet. Looks like the pad at pcb has to be designed such that the pad should extend at heel but short at toe. About the encapsulation. I can understand the requirements. Can you provide me with a more detail proc
Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef
Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because
Electronics Forum | Fri Apr 03 22:08:48 EDT 2015 | rmartini
My company provides high reliability assembly. http://www.pat-inc.com Let me know if I can assist with your requirements.
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Sun Jul 26 05:56:28 EDT 2015 | spoiltforchoice
http://www.surfacemountprocess.com/solder-paste-printing-process.html this site has some pretty good general advice for the novice. I am in no way affiliated with it and I have no idea as to its eventual commerical aims (if any). ENIG if your produc
Electronics Forum | Wed Jun 02 09:21:34 EDT 1999 | Dan Burnikel
Hello all I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with Pol
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
