Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Sat Jun 12 10:23:18 EDT 1999 | Dean
| How are you inspecting pcbs post-reflow, are you inspecting all or sampling. The type of assembly involved would be mainly chip components with a mix of actives and a few 25mil and under pitch. | If you sample what are your fault rates looking lik
Electronics Forum | Tue Apr 15 08:38:23 EDT 2003 | pjc
Don't have any specific links to papers and articles. Try searching on the IPC.org (plus APEX show http://www.goapex.org) and SMTA.org web sites. Any papers and articles on the process from equipment mfg.'s should be taken with a grain of salt. Sold
Electronics Forum | Fri Sep 16 11:28:20 EDT 2011 | dwanzek
I am looking for input on good blacklight to inspect silicon coating coverage on PCB's. This inspection is visual. Any advice or recommendations on lamps or bulbs?
Electronics Forum | Wed Jan 09 20:40:58 EST 2002 | ianchan
Since we are on the topic, What we do over here, is to get SMT Technical to machine pick&place "sample component layouts" onto double-sided tape, which in turn is placed onto an actual PCB... QA will take that double-sided tape sample, and using an
Electronics Forum | Sun Nov 08 10:22:52 EST 2009 | doremi
Hi everybody, First of all, to have process under 100% control you should have AOI after every active process in the pcb assembly line : - Post printing (2D or 3D Solder paste inspection machine); - Post reflow; - Post selective(wave solder). It i
Electronics Forum | Wed Sep 20 12:43:40 EDT 2000 | rcroteau
RF pcb is all gold with no typical land patterns and multiple surface mount components sharing the same pad. IPC-610-B doesn't speak to inspection criteria. The problems I'm seeing are, insufficient solder, skewed components. Some of the pads have
Electronics Forum | Wed Jun 11 18:22:41 EDT 2003 | Steve
Do you happen to know where I may find a supplier for the "little mirror"? Google didn't produce relevant search results for Mentor. My method of inspecting possible bridging under a BGA involved a small flashlight placed up against the edge of the
Electronics Forum | Tue Feb 26 15:20:12 EST 2008 | schorschimi
The german machines use the same basic procedure as the Compact Systems CS-400E but (to my knowledge) no cut and clinch. Can you give any information about manual visual inspection after stuffing boards with such machine. If stuffing boards without
Electronics Forum | Wed Jul 21 01:52:40 EDT 1999 | Scott McKee
| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | In theory, ICT is the classical answer (In-Circuit Test). In practic
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