Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef
IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components
Electronics Forum | Tue Dec 09 09:46:31 EST 2008 | lazzara55
SMT-ypw: Do you have information about IPC D-35 for reference? B3: The D-35 is a subcommittee responsible for developing industry guidelines on the proper handling, shipping and storage of printed boards and printed board assemblies. Moisture is a ma
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Tue Jan 13 15:48:58 EST 2015 | natashakt
170 degrees Celsius) and regular FR4 materials. I am trying to see if we can use table 5 on page 14, "Recommended Equivalent Total Floor Life (Days)" to find out how long (at specific humidity and temperature) our populated and unpopulated PCB's can
Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon
Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha
Electronics Forum | Wed May 03 16:37:10 EDT 2017 | charliedci
I don't believe there should be any issues with the HASL finish. The issue is how long on the shelf and is a bake out required to remove moisture from PCB, as in any FR4 PCB's that may have had time to absorb moisture.
Electronics Forum | Mon Nov 20 06:51:00 EST 2000 | Daniel Carlsson
Does anyone have information regarding: -Moisture level (wt%) that may cause delamination in PCB�s. -Baking time and temperature if using a Vacuum Drying Cabinett and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) -Are ther
Electronics Forum | Tue Sep 16 20:41:41 EDT 2008 | davef
Q1. Can anyone tell me if there is a procedure for storing raw PCB's? A1. Yes, there are thousands of procedures for storing raw PCB. Why so many? Everyone writes their own procedure. Generally, they say: * Boards require individual separation and p
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