Electronics Forum | Mon Oct 16 17:46:49 EDT 2006 | Dan
Recently I was given a bad Bios Link from Toshiba which fried my Bios and now my laptop boots to a black screen. I recently unsoldered and removed the existing Bios chip and have ordered anotherfor replacement. Unfortunately while removing, i damag
Electronics Forum | Fri Aug 30 15:44:51 EDT 2019 | valentink
I will try outline Theta and Z-axis servo issues, we were facing last time. Story behind. Our 750 is used seldom and last time after switching it on initialization procedure ends with T axis of right head: Servo alarm. Opening front cover of 750 two
Electronics Forum | Thu Aug 18 14:13:36 EDT 2011 | davef
Here are a few labs that would be good starting points: * Robisan Laboratory; 6502 East 21 St, Indianapolis, IN 46219; 317-353-6249 F357-1270 Susan Mansilla, Technical Director robisan1@aol.com * Trace Laboratories - East; 5 North Park Dr, Hunt Vall
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno
We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with
Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef
On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you
Electronics Forum | Tue Feb 11 15:54:23 EST 2003 | Jodi Roepsch
I am interested in knowing if anyone has new information about the black pad defect with ENIG plating. I am interested in it from the viewpoint of risk assessment, testing done on final product to isolate failures,and root cause of the defect. Than
Electronics Forum | Wed Mar 19 09:59:45 EST 2003 | davef
Jodi What's your thinking on the black pad rework technique proposed in: �A Failure Analysis And Rework Method �� Z. Mei, et al, SMTA International 1999, p407
Electronics Forum | Thu Jun 30 03:14:34 EDT 2016 | andrzej
Looks like "black pad" issue. More about this here: http://www.ipc.org/feature-article.aspx?aid=Black-pad Definitly PCB supplier need to improve the process.
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
