Electronics Forum | Fri Jul 28 08:08:18 EDT 2006 | Chunks
Screen printer, placement machine(s) and oven. You may also need a hand insertion line, selective solder or wave soldr and some form of electrical test. There are a ton of name brands that no two people can agree on. To get a better feel for what
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4（TG135,TG150,TG170,TG180），Halogen Free FR-4，Ceramic
Electronics Forum | Thu Apr 24 09:34:37 EDT 2003 | caldon
We autoclave our medical PC boards (Sorry Bad Joke). With the Steam process I am concerned that the water (Solution) is not Clean. So I am curious to the process of steam cleaning: Is It Presure Steam? is the Water DI, ION free, street water...? you
Electronics Forum | Mon May 21 17:32:23 EDT 2001 | davef
I said: "Our electronic circuit board fabricators seal the boards in moisture barrier bags [MBB]. We discontinued the use of desiccant bags in these MBB because of concerns about the desiccant releasing materials that would affect the solderability
Electronics Forum | Fri Aug 20 13:36:46 EDT 2004 | ttye01
We conduct temperature stress test (-40 to +100C)on our products which sits on our expensive test board. This stress test on our product shorten the life span of the test board due to the extreme temperature change. I have tried epoxy coating on the
Electronics Forum | Sun Aug 22 22:31:31 EDT 2004 | ttye01
Hi Dave, Thanks for the input. Will certainly take your advice. Thomas
Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike
I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste
Electronics Forum | Sat Aug 21 08:00:50 EDT 2004 | davef
First, we know of no conformal coating that will help your situation. Second, as you say, companies recognize that stress testing of shippable products is NOT good practice, because it strips life from the product. So, your product is more expensiv
Electronics Forum | Wed Oct 20 10:49:04 EDT 1999 | Brian
Hi! Stu's method is a half-truth. What it measures is the aggregate of all volatile material with a significant vapour pressure at the baking temperature, not just H2O. Short of very complex methods, it could be complemented by a comparitive measur
Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef
The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking
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