Electronics Forum | Wed May 16 13:06:33 EDT 2007 | stepheniii
3.3.2.1 Moisture Barrier Bag (MBB) The moisture barrier bag shall meet MIL-PRF-81705, TYPE I requirements for flexibility, ESD protection, mechanical strength, and puncture resistance. The bags shall be heat sealable. The Water Vapor Transmission Rat
Electronics Forum | Mon May 31 15:09:56 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Mon May 31 15:10:14 EDT 1999 | JohnW
| | | | | | | | I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processi
Electronics Forum | Tue Dec 09 09:46:31 EST 2008 | lazzara55
SMT-ypw: Do you have information about IPC D-35 for reference? B3: The D-35 is a subcommittee responsible for developing industry guidelines on the proper handling, shipping and storage of printed boards and printed board assemblies. Moisture is a ma
Electronics Forum | Tue Oct 11 14:10:51 EDT 2005 | Amol
Hi, I have a very basic question for tin whisker testing. Do I thermal cycle/age the Components only or solder them to a ckt board and then thermal cycle/age the PCB assembly??
Electronics Forum | Thu Nov 17 14:39:49 EST 2005 | Amol
Hi John, any particular criteria you used to determine the component/PCB surface finish for the final assembly?? I am in the process of transitioning....so far testing test vehicles to find out the surface finish combination...with actual boards to
Electronics Forum | Thu Nov 10 10:15:40 EST 2011 | davef
J-STD-003 describes the test methods and gives guidelines for assessing the solderability of bare circuit boards
Electronics Forum | Fri Sep 15 09:24:54 EDT 2000 | C.K.
At my last place of employment, that was the big reason why nobody (especially the Design Engineers) bought into a no-clean process - interference with high-impedance circuits. One guy was so paranoid about flux residues remaining on the board, that
Electronics Forum | Tue Dec 15 15:21:17 EST 2015 | davef
Peculiar that ENIG boards are corroded, not that it can't happen. * J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * J-STD-003, Solderability Tests for Printed Boards The first person I'd talk with is my
Electronics Forum | Mon Oct 06 12:37:18 EDT 2003 | ramanandkini
It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediately 1 hour @ -40 deg.c. The second test I did was a high humudity test for a week. After each test, I carried out a peel test with scotch tape. Those bo
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