Electronics Forum | Wed Apr 23 19:00:39 EDT 2008 | stevek
It depends on the laminate but a PWB is like any other MSL component. Some fab shops are only waranting standard FR4 laminates for 45-60 days when processed at lead free temperatures. The best thing I can say is to try some weight gain/loss experim
Electronics Forum | Tue Nov 03 06:23:12 EST 2009 | josh_brubaker
Has anyone ever done a tape test to see if the solder resist pulls away from the PCB? Is this an acceptable method for testing solder resist acceptability? This is an issue I am experiencing with our PCBs. I am receiving boards with excess solder o
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Mon Apr 23 20:33:37 EDT 2001 | davef
I agree that solderability is THE issue, but we choose not to get into that pissin' contest. [We don't like the selected test method, either.] We believe that our coating thickness spec provides: * Solderability level that we seek. * Repeatable tes
Electronics Forum | Tue Apr 24 12:44:11 EDT 2001 | Steve
Take a look at J-STD-003, Solderability Tests for Printed Boards. This may help you create a procedure.
Electronics Forum | Fri Jul 27 10:07:18 EDT 2007 | rgduval
Our preference has been ENIG. We find that we achieve higher quality (visually) soldering for through hole and surface mount parts, with less handling issues than when we use white-tin, or immersion tin. We are about to do a test on some boards tha
Electronics Forum | Fri Oct 08 21:21:21 EDT 1999 | John
Although I can specify it, is ther a way I can test in test (in house)to be sure it's as specified? I don't need it now. I'm thinking of when I will need it. Thanks, John | | Hi, | | | | Does anybody know what is the minimum gold plating thickn
Electronics Forum | Mon Apr 23 17:30:08 EDT 2001 | davef
Step 1: Print paste on the board, skip placement, reflow the board, check solderability. Step 2: Goto Step 1. White Tin Solderability: The most common reason for solderability issues with the white tin surface coating during multiple thermal excur
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Mon Apr 23 19:12:23 EDT 2001 | relensky
Thanks for the instructions. I was missing the reflow part... Omikron is the method our board house offers. We have been through the plating thickness problem and tin depletion conditions. Beyond those issues, I have been trying a few different n
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