Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Mon Jul 26 10:25:12 EDT 1999 | Boca
| | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that a
Electronics Forum | Mon Jul 26 14:14:51 EDT 1999 | Steve Gregory
| | | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is th
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Fri Mar 02 08:52:20 EST 2001 | markkrmp
Are your voids looking like blow holes also? Is this only occurring on the solder joints of the Thru Hole components and Via's? Or does this happen on SMD pads? My experience is that we have seen this but only with some of our older PCB's which are
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
Electronics Forum | Wed Oct 30 23:14:41 EST 2002 | caldon
Doug is right contaminates can be transfered from hands to boards easily. I also know gloves are a good practice as some times people wear moisturizers and hand creams that can also cause issues. Another thought is that you do not want people handl
Electronics Forum | Fri Jun 01 11:06:17 EDT 2012 | davef
Post-reflow delamination is almost always caused by entrapped moisture. Here's more from the fine SMTnet Archives ... http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=64774 As Graham Cooper suggests in an earlier posting on this thread, ba
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