Electronics Forum | Mon May 18 11:50:23 EDT 1998 | Earl Moon
| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac
Electronics Forum | Tue Oct 30 21:42:32 EST 2001 | surachai
I have question about board baking after in line washing machine then I would like to know some information that ; 1) Do we need board baking after in line washing machine? Both bare board and assembly borad normally we don't bake . 2)In case of ne
Electronics Forum | Thu Jul 14 02:25:59 EDT 2016 | salini
Thanks Evtimav and davef... We are doing tar potting only over the moisture sensitive device (not all over the PCB) to make sure that it does not get effected by moisture. But am unable to test the reliability of the process. Continuous switching or
Electronics Forum | Wed Sep 14 07:30:57 EDT 2005 | davef
What is a soak test? Do you mean a recipe for removing moisture from a board?
Electronics Forum | Thu Jun 20 04:41:47 EDT 2002 | redmary
thanks, but I also encounter the solderability problem. because these boards are HASL or Ni/Au finish, and we print the solder paste and reflow, the result shows the some non-wetting area. and the reliability test also proves to be bad. so the critic
Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad
One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,
Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain
Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it
Electronics Forum | Thu Aug 21 16:00:31 EDT 2014 | davef
This links to a NPL presentation on moisture removal from PCB http://www.npl.co.uk/upload/pdf/20140318_effect_baking.pdf Consider: * Focusing on preventing moisture contamination of boards, rather than removing moisture * There will be no standard
Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff
| | Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use
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