Electronics Forum | Sat Jun 06 15:14:35 EDT 2009 | ysutariya
If the concern is the increased moisture absorption associated with lead-free capable materials, you probably have the most experience with phenolic materials like Isola IS410 or 370HR. The best move would be to switch to an IPC 4101/99 or /124 mate
Electronics Forum | Mon Mar 12 08:00:14 EDT 2007 | rgduval
It sounds like you may be thinking of two different test methodologies. What is required? Bare-bard testing, to verify pcb fabrication? Or populated board testing, to verify manufacturing? If it's bare board testing, the fab house should advise a
Electronics Forum | Tue Apr 23 15:36:27 EDT 2019 | davef
Josh, are you setting someone up with these questions? Answers to your questions related to the subject line follow: Q1. Does the Epoxy Solder Mask Layer of a PCB protect against moisture absorption? Is this a primary function of the solder mask?
Electronics Forum | Thu Jan 16 16:15:27 EST 2003 | billg2753
I have received a few boxes of fully assembled boards that have damaged packaging boxes due to rain water. There is visible moisture inside the ESD bag. I have no idea how long these boards have been exposed to moisture. Does anyone have a procedure
Electronics Forum | Thu Mar 11 03:03:26 EST 2010 | grahamcooper22
Hi , Looking at your photo....can I also see a hole in the middle of the joint on the chip component ? Maybe its not just a problem with th ejoint son diodes ? Did you also get mid chip solder balls on chips? If so, I'd almost guarantee the pcb has t
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Wed Sep 22 21:15:44 EDT 2021 | djenkins62
Hello Everyone: Heat Can Be Very Damaging to Boards and well as extended oven time can cut into valuable production time. Steel Camel is testing ambient temperature drying to remove diffused and embedded moisture in PCBs. We are seeking scrap pie
Electronics Forum | Mon Apr 07 04:33:43 EDT 2003 | Neil
Iman, How long after washing the boards do you process them? Are there any vias or Micro vias on any of the pads you see the blow holes on? A possible cause of a blow hole in a solder fillet or PCB is the escaping of Moisture under extreme temps. Th
Electronics Forum | Fri Jun 01 16:13:45 EDT 2012 | kahrpr
You also need to get with the PCB manufacturer. Their is a lot that can go wrong with that many layers. If the manufacture is trapping that much moisture. you may have a hard time baking it out. Dave and Graham are right about the time and energy. It
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