Electronics Forum | Wed Apr 08 07:49:25 EDT 2009 | davef
We don't view this as "board delamination." It looks more like "solder mask bubbling." It may be the picture. Please describe the issue or enclude additional pictures.
Electronics Forum | Fri Aug 27 00:26:14 EDT 2004 | charly
hi, encounter few cases PCB was delam after reflow, and the supplier was refuse that this is a PCB manufacturing defect as the fallout is low within one lot. the cost for this scrap is high after PCBA level, my query here are 1) is there any way
Electronics Forum | Tue Oct 07 03:55:03 EDT 2014 | puja
How to avoid /reduce warpage in long length PCB &
Electronics Forum | Tue Oct 07 22:15:12 EDT 2014 | padawanlinuxero
How to avoid /reduce warpage in long length PCB & > _1.6MM THICK PCB. You need to put it in a fixture or pallet to run it in the reflow oven, most common material use here is durostone for the pallets that we run in the reflow oven, we use Durosto
Electronics Forum | Wed Jun 26 14:33:52 EDT 2019 | slthomas
Do you have any images that show the soldered terminations? Also images of the pcb terminations after the part has moved might be helpful.
Electronics Forum | Wed Jun 26 23:35:55 EDT 2019 | anhsang38
There are some pictures of solder and pcb terminal after part has moved. https://ibb.co/5hKBxXX https://ibb.co/Kw27cns https://ibb.co/HtKBMdW Rg Sang
Electronics Forum | Thu Apr 16 11:58:20 EDT 2009 | ccross
We have seen this exact same problem. Our vendor agreed it was their problem and also agreed it was a moisture issue within the PCB layers, not the solder mask. We have taken to baking our boards, especially when they are manufactured during the late
Electronics Forum | Tue Oct 07 08:44:49 EDT 2014 | emeto
Hi, 1. I will run the board on the mesh if single sided. 2. For double sided board, I will try stiffeners. 3. If stiffeners don't work, then you have to create a handling fixture(holds the board and has enough openings to let the air flow to the PC
Electronics Forum | Mon Apr 01 10:09:03 EDT 2013 | markhoch
It sounds as if you have your AOI set up off-line, and you're "AOIing" a sampling of the PCBs produced. If that’s the case, then the responsibility of who drives the inspection really depends on how you configure it. If it's based on the number of P
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
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