Electronics Forum: pcb cleanliness requirement (Page 3 of 109)

PCB finish requirement for COB process

Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary

we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks

PCB finish requirement for COB process

Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp

I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.

PCB finish requirement for COB process

Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef

Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt

pcb manufacturing

Electronics Forum | Fri May 25 05:54:13 EDT 2018 | daisytu2018

Hi Maxim, We are a manufacture professional in PCB and PCBA. We can deliever sample within 36 hours with high quality according to your requirements. Contact us via daisy@k-pcbz.com phone 86-17707340946

ALIVH pcb

Electronics Forum | Tue Apr 09 18:29:34 EDT 2002 | davef

Any-Layer Interstitial Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve high-den

aluminum pcb

Electronics Forum | Fri Nov 07 18:26:05 EST 2003 | jsloot

Is anyone using .062 aluminum circuit boards with copper conductors in your production lines? What kind of reflow profile is required? What special considerations are there to be looking for? I am asking for any information you can give me. Thanks

pcb manufacturing

Electronics Forum | Fri Apr 03 22:08:48 EDT 2015 | rmartini

My company provides high reliability assembly. http://www.pat-inc.com Let me know if I can assist with your requirements.

Floor life pcb assembly

Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef

The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking

defects in pcb manufacturing

Electronics Forum | Sun Nov 01 23:34:25 EST 2009 | 89jeong

Hello Julie Yr supplier is saying that these boards meet the requirement of IPC-A-610. I think that you need to check this requirements at least. But, it does dot mean that these are acceptable. Thanks.

pcb laser markers

Electronics Forum | Mon Jul 12 11:11:25 EDT 2004 | Stefan

For laser marking you don�t require as powerful lasers then for cutting. A 20 Watt laser diode does already a good job. Because of the safety requirements the laser operates in an enclosure, which means more $$$ if you want to use the laser in line


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