Electronics Forum | Mon May 22 10:41:50 EDT 2000 | Scott G
Can anybody provide information on shear testing of passive components. What standards are used etc. Thanks
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.
Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz
Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Fri Mar 30 20:06:55 EST 2001 | aortiz
Maybe there's no test and I don't know where or why my customer came with that requirement (I think because in one of the board shipments he got a board were a smd resistor broke, but I think that happened because miss handling), but anyway I need so
Electronics Forum | Wed Jul 03 15:40:17 EDT 2013 | davef
Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied than on the grain structure. When shearing a component, you not only apply shear stress, but also roll
Electronics Forum | Sun Mar 03 22:15:13 EST 2002 | caldon
RPS (Robtic Process Systems - I think) Makes a system called a Wet Balance tester. This machine is useful for Solderability on PCB sections and Components. Also for more info please go to http://www.empf.org/html/empfset.htm and down load Decemeber
Electronics Forum | Thu Jul 27 16:54:46 EDT 2006 | pjc
In-Circuit test, or ICT, is the most common method of electrical test for an assembled PCB. It is the most comprehensive and accurate method to ensure that both the PWB and components are working to specification. Not all components however can be el
Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard
Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
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