Electronics Forum | Tue Jul 22 20:38:28 EDT 2003 | Paul T.
Have the PCB fabricator use a conductive paste to fill the vias and then finish by plateing over the via. Make sure it's coplanar to the side they're on, usually secondary side for discretes. PT
Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie
Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane
Electronics Forum | Thu Feb 25 22:01:52 EST 1999 | Chris G.
| Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts
Electronics Forum | Mon Dec 03 12:15:51 EST 2007 | rgduval
We've just completed an experiment for one of our customers using lead-free HASL. From a manufacturing standpoint, everything seemed to have run fine. Solder profiling seemed to be unaffected, pick and place was unaffected, and the end result looke
Electronics Forum | Thu Jan 16 05:10:46 EST 2020 | soupy
Hej, we have some connectors placed on our PCB. 2*30legs 0.5 After reflow we detect lifted legs in the AOI. Always on the outer corners. Is this something ye have experienced? And any possible solutions? Stuff we have tried: Checking the cop
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Wed Feb 09 13:07:01 EST 2000 | Jeff Woodruff
I have seen an issue that escapes our ICT and functional testing or operates in an intermitent fashion. The lead is slightly separated from the PCB with a fully formed solder joint behind it at the heel an toe. The joint apears to have started to tra
Electronics Forum | Tue Jan 14 11:39:51 EST 2020 | avillaro2020
Thanks Robl. I’ve contacted samtec followed their advice but ended up empty handed. Originally my stencil thickness is 6 mils, samtec stressed the need for the paste and charge to have good contact but this is challenged by the inherent charge non-co
Electronics Forum | Mon Aug 14 13:48:03 EDT 2023 | spoiltforchoice
Well gasketing yes, have you dine enough analysis to blame aperture design- Maybe not? Maybe whip out the gerber files for this PCB&stencil and compare the details with one you feel works well. Is there something different about their layout rules o
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