Electronics Forum | Mon Mar 24 09:09:40 EDT 2008 | jdumont
Hello all, we have been seeing a lot of issues with broken or open vias on a couple of our bare boards. We have two vendors make these for us and the issue is only with one vendors boards. We have stopped using them until we can figure out what is go
Electronics Forum | Wed May 25 21:03:30 EDT 2011 | thanhnguyen22
Hi All, I am new the PCBA process fabrication. I have found many cracks in the PCB after we have cross sections analysis. The cracking has same kind of pattern. It happens betwen the solder and the PCB, or between the solder and the part, BUT not be
Electronics Forum | Mon Jul 28 11:59:50 EDT 2008 | davef
Do you have pictures of the cross section that you could post? Here is a recent thread that could give information about what you see with your board http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=54803
Electronics Forum | Mon Feb 23 21:27:20 EST 1998 | fxb
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Thu Jan 22 20:10:19 EST 1998 | Raymond
I have the following questions with regards to the solder printing stencil design : 1) Is the Electro-polish process recommended for laser cut stencil ? 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal openin
Electronics Forum | Tue Jan 27 08:08:51 EST 1998 | Jon Medernach
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Thu Sep 20 15:05:20 EDT 2007 | jax
You can specify the prepreg thickness in the stackup. Once you have specified it somewhere, make your PCB manufacturer build to it... and prove it through cross-section analysis. Depending on the Board cost, we require a cross-section and analysis d
Electronics Forum | Tue May 06 23:16:20 EDT 2008 | hhorse
Could you tell me how to detect PCB delamination issue? through cross section, SAM or others?
Electronics Forum | Mon Jan 26 08:58:05 EST 1998 | Mike McMonagle
| I have the following questions with regards to the solder printing stencil design : | 1) Is the Electro-polish process recommended for laser cut stencil ? | 2) Should the aperture walls be slanted at an angle or straight wall, i.e. trapezoidal |
Electronics Forum | Thu Apr 15 05:17:51 EDT 1999 | Barry Aylett
Can anyone suggest or identifiy standards which tabulate the following: Conductor width, cross sectional and area conductor thickness for PCB's carrying up to 70 Amps?
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