Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Tue Jun 25 01:24:25 EDT 2019 | sssamw
That is possibley CTE mismatch between QFN and PCB material, the thicker PCB the higher fail rate.
Electronics Forum | Wed Jun 29 17:38:16 EDT 2005 | GS
Several years ago, we had almost same pbm, best results have been obtained by using water soluble paste (those time the old AM1208). Any way, to get a good toe meniscus is not so easy. Talking about CTE, keep in consideration the internal die of TSO
Electronics Forum | Thu Dec 10 03:37:29 EST 1998 | Youngho Song
Hi everybody? I heard that typical FR-4 would not acceptable for BGA application. What is the main reason? (thermal property? or CTE?) Sombody please answer me the requirement of PCB substrate for PCB application. Thanks. Youngho Song
Electronics Forum | Sat Nov 03 05:41:07 EST 2001 | Ben
Hi Could somesomeone help to let me know can bare PCB (FR4) is damaged by thermal shock? Can difference of CTE from copper or solder to FR4 damage PCB from apply heat too fast? Any specification or standard can i refer? Thank you Ben
Electronics Forum | Thu Jun 04 02:16:43 EDT 2020 | SMTA-Robert
Looking for CTE and young's modulus values for aluminum backed PCB for solder joint predictions. The data sheets are a bit sparse, and the weighted average method somehow doesn't feel appropriate. Any advice is welcome. Thanks!
Electronics Forum | Thu Jul 12 20:20:31 EDT 2007 | seankim10
I�m having problem with PCB with 16mil thickness due to warpage. the board convex up in the middle after 1st reflow. It seams the warpage is caused by CTE mismatch between PCB and multiple TSOP's, which are covering ~80% of the bottom side board area
Electronics Forum | Mon Aug 06 17:29:07 EDT 2007 | gsala
Hi Gents, I heard people having concernes by using 2512R SMD resistors due to potential solder joint reliability defect(CTE mismach among ceramic/alumina+solder+PCB) when soldered by lead free alloys (SAC like). Any experience/news about solder j
Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78
I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m
Electronics Forum | Wed Jun 22 09:12:57 EDT 2005 | bsudak
Our manufacturing site has been struggling with soldering Alloy 42 TSOPs. Currently, we have to hand solder in one of our applications. Here are the particulars. Component: 54 leads, Sn plated, 400microinches +/-200. Process: Eutectic 63/37 Sn/Pb
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
winsouce.jpg)