Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Electronics Forum | Sat May 02 23:31:06 EDT 2009 | kareal
Thanks davef. The defect always occurred during UHAST reliability, but not find in reflow. The key is that there is tin diffuse to copper trace under solder mask. is it a "normal" board defect and what is the potential risk for device? thanks!
Electronics Forum | Thu May 07 19:29:40 EDT 2009 | kareal
Hi Davef, Do you means it is natural for tin diffusion to copper trace during SMT process? but I could not detect tin in UHAST T=0 unit, and the tin diffusion was found only in copper trace of C4 cage. Two question: 1) Could you tell me which pr
Electronics Forum | Sat May 09 09:00:54 EDT 2009 | davef
For more on using tin as a resist during bare board fabrication, read "2.5.6 Introduction To Tin And Tin/Lead Plating" here: http://books.google.com/books?id=etfNcpiR5ZUC&pg=PT570&lpg=PT570&dq=%22circuit+board%22+%22etch+resist%22+%22acid+sulfate%22&
Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef
From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff
Electronics Forum | Wed May 28 05:49:19 EDT 2008 | aj
Hi all, I would like to know what sort of peak temps people are seeing during reflow - I understand that there are many variables that contribute to this but there should be an average through out all the profiles. We are still seeing issues with d
Electronics Forum | Tue Aug 06 08:21:28 EDT 2013 | leeg
I have been asked a question on what procedures we should in case of a PCB delaminating during the reflow process, e.g what gases can be produced and any evacuation /re-entering checks that we should do before allowing the operators to return to thei
Electronics Forum | Tue Apr 23 18:34:45 EDT 2002 | mkallen
My first posting was not very clear -- sorry. Let me try again. What I want to know is: can I eliminate the drying (baking) process completely IF I know that the good parts (i.e., those not being reworked) are going to stay under some threshold tem
Electronics Forum | Fri Aug 05 09:37:11 EDT 2011 | rgduval
From the fine SMTNet archives: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=12824&#Message54659 There are a few other threads available, as well, by searchign on PCB Delamination. Delamination post reflow is almos
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