Electronics Forum | Tue Oct 17 03:13:10 EDT 2006 | charless
Apoligies Steve if I did not explain myself clearly. We have made the same design using the same RoHs compliant components (which I am assured by the suppliers are process temperature capable) with both lead and lead free solder. Without wishing to
Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon
| Hi, | | Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? | | Joe | What's the cost of not doing it. In the same breath, why not wait for a sc
Electronics Forum | Fri Feb 16 11:37:58 EST 2007 | hectorsmtnet
I have been using the Loctite Multicore WS200 with great results for the last two years. We also use the lead free version WS300. I like the flux chemistry (which is the same for both products); it really withstands long soaking times and with very g
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Wed Aug 19 15:24:21 EDT 2009 | smt_guy
I have a customer who approved and asked us to process PCB's built with Lead-Free HASL Finish using Eutectic Solder. We did as directed and inspected the result from a 10-PCB Run and couldn't find any problem with solderability or issues. What Issue
Electronics Forum | Mon Apr 17 16:17:47 EDT 2000 | Dennis Fall
Typically, Sn/Pb solders are used to preserve solderability on leaded and leadless SMT components. Are other finishes (such as those used in PCB manufacturing e.g. Sn, NiAu, OSP's, etc.) frowned upon by PCB stuffers and their customers? I am intere
Electronics Forum | Thu Nov 13 09:27:21 EST 2008 | cisridn
I have tried covering the vias with thermal tape and that did not work. I like the idea of plugging the via with a temporary solder mask. I will try that the next time I build a fixture which should be tomorrow. This is mainly a problem only becau
Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan
What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul
Electronics Forum | Thu Apr 27 11:36:53 EDT 2000 | PeterB
Russ, We also use 'immersion silver' and have not had any impact on our processes. In fact there are a number of benefits i.e very flat pads (as good as electroless nickel/immersion gold but much cheaper and less unfriendly to the environment), good
Electronics Forum | Wed Jul 11 12:26:54 EDT 2001 | mzaboogie
Hi Ian, Answers to your questions: 1) PCB Pad Finishing- HASL 63/37 2)Checked a sample lot of parts. Coplanarity did not seem to be an issue. Some of the parts checked still exibited this condition after reflow. 3) There are no large ground plane
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