Electronics Forum | Wed Aug 30 08:20:40 EDT 2006 | Bob R.
Are there any standard qualification/acceptance requirements for immersion tin board finish? J-STD-003 calls out temp/humidity preconditioning followed by solderability testing which is similar to what we have in our (ancient) internal documents. O
Electronics Forum | Fri Aug 30 16:25:21 EDT 2002 | davef
Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to make imm silver tough to solder after heating and sitting are: * Oxidation of the silver. * Reduction of the co-deposited organic anti-tarnish [used in
Electronics Forum | Tue Aug 09 11:57:11 EDT 2005 | Board House
Hi Ted, I am a Sales Manager for a Circuit board Manufacture in MN. We have seen the Majority of our Customer base switch to Enig do to shelf life issues of silver and Tin. Silver, Tin & OSP all have a shelf life between 6 - 8 Mos. Enig is betwee
Electronics Forum | Mon Aug 08 22:32:18 EDT 2005 | adlsmt
If you are using fine lines and tight spacing ENIG may be cheaper than HASL. This is because there is not as much bridging at the board house between traces so they do less touch up. This would probably be even more true with no-lead. We have been us
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Tue Sep 24 23:02:59 EDT 2002 | redmary
For the COB process, what thickness for plating Au is suitable? IS there any specification for this issue?
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp
I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Fri Jul 23 10:08:31 EDT 2004 | B. Hunter
We received bare PCB's that were supposed to have been finished with immersion silver because of BGA locations. The boards were finished in ENIG. We are concerned over any reliabilty problems that might occur as a result of using ENIG at BGA locati
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