Electronics Forum | Thu Mar 03 09:11:25 EST 2005 | russ
I wouldn't raise the temps just slow the conveyor, You need to get the PCB "soaked in". It seems as if you are applying more thermal energy than the PCB can accept in all areas. Does this oven have convection heating? Hopefully so. I have found t
Electronics Forum | Thu Mar 11 03:03:26 EST 2010 | grahamcooper22
Hi , Looking at your photo....can I also see a hole in the middle of the joint on the chip component ? Maybe its not just a problem with th ejoint son diodes ? Did you also get mid chip solder balls on chips? If so, I'd almost guarantee the pcb has t
Electronics Forum | Thu Sep 12 15:51:29 EDT 2013 | gregp
Hi Dean, Thanks for the feedback. I suppose I should reveal the nature of my query. Contact Systems was founded by my father back in 1970. I worked there from 1983 until we closed the doors back in 2009. I acquired the assets and intellectual pro
Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Fri Nov 21 05:40:49 EST 2014 | spoiltforchoice
I meant more from the programming perspective, make sure you make the most of what you can do with modern computing interfaces. Making configuring/creating jobs etc as accessible as possible to as wide an audience possible. As an example look at how
Electronics Forum | Wed Nov 19 15:16:47 EST 2014 | warwolf
Interesting, see we used to do a large amount of PTH but we have been able to convert most of those parts to SMT now. the majority of our PTH is connectors. I am doing some research as to the types of through hole assembly that still remain.- This d
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Thu Jun 02 10:54:12 EDT 2011 | davef
Al: We agree with AVFOM. You have a different problem than solder paste mesh selection. Most often, tombstoning occurs when the wetting forces on the two pads are unequal. Examples of things that can cause this are: * Pads are different * Board pad
Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh
| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p
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