Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.
We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f
Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Sat Apr 10 01:11:37 EDT 1999 | forest
Our company is going to use BGA(1.27mm pitch) But I have heard of troubles with P-BGA. It is that cracks occured between solderball and gold plating of PCB during ICT(incircuit test). We know that gold plating of PWB is not good for BGA, so we decide
Electronics Forum | Mon Jul 12 00:23:02 EDT 2010 | leadthree
I had cracking caps from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. That put lots of mechanical stress on the PCB. So have also a close look at the ICT, or another other test fixtures you use.
Electronics Forum | Thu Sep 12 11:26:11 EDT 2002 | scottefiske
CK, If joints have been validated prior to ICT (under BGA Scope), more often than not repeatable joint fractures are due to undo stress being placed on the component during ICT test. Verify ICT probes and fixture. If after proving out fixture/pin com
Electronics Forum | Thu Nov 13 11:45:04 EST 2008 | pbarton
We have seen a similar problem. Turned out to be mechanical stress on the component caused by the method of location and clamping at ICT. Where is the component located on the assembly? Poorly adjusted clamping pillars on clamshell fixtures can cause
Electronics Forum | Mon Dec 12 13:09:46 EST 2005 | Kris
do you intend to use Immersion tin as a PCB surface finish ? Then Whisker concern is as below if you do not past your test pads, the pads will be stressed when probed on a ICT or a flying probe tester. This is a POTENTIAL for whiskers There is a lo
Electronics Forum | Fri Aug 20 13:36:46 EDT 2004 | ttye01
We conduct temperature stress test (-40 to +100C)on our products which sits on our expensive test board. This stress test on our product shorten the life span of the test board due to the extreme temperature change. I have tried epoxy coating on the
Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh
Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr
Electronics Forum | Thu Nov 14 05:45:51 EST 2002 | Jon O'Connell
Has anyone had experiences of ICT test fixtures actually damaging the PCB boards - typically when they have moved away from HASL finish to OSP. I would also like to hear more about any specific issues seen at ICT for non HASL pcb finishes thanks -
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