Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech
As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Sun Sep 27 06:00:24 EDT 1998 | Roni Haviv
Hello, I need some users information about "Air knif" in wave soldering: 1. Does it decreases bridging ? 2. Is it self installed of a purchesed kit (if purchesed, who are the recomended vendors) ? 3. Any other information about the issue.
Electronics Forum | Thu May 28 01:48:16 EDT 1998 | Roni Haviv
Hello, I need some users information about "hot air knife" after the wave bath: - Defects reduction ? - In what kind of boards(TH/SMT SOICS ect.) it is applied ? - Where can I purchase it as a retrofit (Soltec Delta 6622cc) ?
Electronics Forum | Wed Feb 05 19:43:34 EST 2003 | iman
If by the Powers Ta Be (customer/designer), you can't change the PCB design, negotiate for the PCB fab house, to block the via holes with their (green?) solder mask some customers/designers want to have via holes to be present in the PCB pad, due to
Electronics Forum | Wed Mar 09 20:36:03 EST 2005 | amstech
We are looking for a PCB / copper etch services in India and interested parties may contact us at goburam@yahoo.com Regards.amstech
Electronics Forum | Wed Nov 14 01:18:20 EST 2007 | reypal
How about your bare pcb handling? do you stuff smd component prior hand soldering? you can try to bake the pcb and then see if this problem still exist.
Electronics Forum | Fri May 08 20:59:21 EDT 2009 | kareal
Davef, do you have some information about your mention "tin was used to protect copper trace ans will be removed"? It is very important for my project. Because we are assy and test plant, no any information from PCB vendor. Thanks!
Electronics Forum | Mon Oct 26 12:40:08 EDT 2009 | awtm
pls find attached photo from Supplier saying that the failure at pth hole was due to blistering caused by moiture evaporate rapidly resulting delamination occur on FR-4 material from an old PCB (3yrs). Pls advise if attached picture confirms such co
Electronics Forum | Thu Feb 09 20:12:51 EST 2017 | imarkl
Any advise about dewetting defect occurrence during 2nd pass reflow. Commonality on affected PCB having water marks near affected pad(s). Elemental composition found on affected pads without solder paste are Silicon and Sulfur. As well as in pad with
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