Electronics Forum | Fri Feb 07 15:17:14 EST 2003 | MA/NY DDave
Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via holes through the pcb either to an internal plane or to the other side. I can imagine creating an interesting stencil to accomodate the vias yet you are
Electronics Forum | Fri Jul 28 09:24:17 EDT 2017 | jpepke468
A lot of our PCB's are being damaged by our water cleaner, it is a Steolting Triton, and I beleive it is due to the drying section in the machine. The air its blowing on the boards is flipping the boards around on the conveyor and smashing small deli
Electronics Forum | Tue Dec 05 22:27:05 EST 2023 | padawanlinuxero
Hello, I am experiencing issues with one of my PCB suppliers. Specifically, I am having trouble with solder shorts occurring on a SOIC8 component, and always in the same pads. Upon inspection with a microscope, I discovered that three of the pads ar
Electronics Forum | Mon Mar 23 16:20:10 EST 1998 | Robin Arnold
Do you know if there is an IPC standard or industry standard that addresses the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development Harris Semiconduc
Electronics Forum | Mon Mar 23 16:17:39 EST 1998 | Robin Arnold
Do you know if ther is an IPc standard or industry standard that addreese the issues regarding the proper process for handling MSD's in the production environment....? (rework etc.) Not the receiving area. Thanks so much, Robin Arnold PCB Development
Electronics Forum | Fri Sep 28 16:51:41 EDT 2001 | pcmarch
I have had success by applying the paste flux with my finger, using a finger cot and spreading it on the PCB. This seems to put it on more consistently than using a brush.
Electronics Forum | Wed Dec 04 04:29:51 EST 2002 | CH
U might need to run the board on a reflow pallet with a clamper. This will help to solve the warpage problem on the PCB and connector.
Electronics Forum | Tue Jul 22 20:38:28 EDT 2003 | Paul T.
Have the PCB fabricator use a conductive paste to fill the vias and then finish by plateing over the via. Make sure it's coplanar to the side they're on, usually secondary side for discretes. PT
Electronics Forum | Mon May 03 21:39:09 EDT 2004 | ACE
Does anyone know there a standard matrix of clearances part to part for Class 2 and Class 3 board design. IPC does issue a preferred matrix but they are so liberal they not so useful in the real world. Any suggestions would really be appreciated.
Electronics Forum | Wed May 05 09:23:11 EDT 2004 | InterConn
Hi ACE, I design with a Minimum of 0.40mm Body to Body on 0805 Chip size down for hi volumne products, 0.60mm would be preferred. Regards I/C
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