Electronics Forum | Tue Oct 27 22:52:18 EDT 2009 | davef
Top picture: We're not wild about the 'poor registration,' the differing thickness of the solder mask, and the crud all over the board. But, then again, we don't have a basis for rejection. Bottom picture: No basis for rejection Help us out, what do
Electronics Forum | Wed Oct 28 07:26:19 EDT 2009 | julie331975
I don't like these boards for a couple different reasons. 1. They may be fine functionally but they look like crap. 2. What is our customer going to think when we deliver boards that look like this? They will probably wonder the same thing I do...
Electronics Forum | Thu Oct 29 18:33:18 EDT 2009 | comatose
The top picture probably won't run. You have black soldermask dramatically misregistered and overlapping what look a lot like fids. Either your machines are going to pitch a fit and not find the fid or they're going to center on the soldermask outlin
Electronics Forum | Mon Nov 02 07:16:47 EST 2009 | umar
Base on the top picture condition, seems like the boards condition is a lot with solder splash or solder ball which is per IPC-610 is under reject (under 5.6.2)for class 3 product. While the picture 2 is showing those the solder resist is not melt pr
Electronics Forum | Tue Nov 03 18:09:17 EST 2009 | gregoryyork
I think most have summed up the first pictures also is the drillng looking like it is misregistered as well. Better to do a solvent test to determine resist cure not the old stuff the newer chemicals show under cure problem much better. Try your st
Electronics Forum | Sun Nov 01 23:51:44 EST 2009 | boardhouse
Hi Julie, My opinion is that the top board would not pass IPC, solder mask encroachment on pads. Second board is what we call Orange peel,this can be caused two way's. 1) the solder mask was not tack dried enough prior to imaging which caused artwo
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Fri Sep 08 03:37:54 EDT 2017 | m_imtiaz
there any problem if Lead Free finish PCB being process using Leaded Solder Paste...? It is totally related to the manufacturing process and quality of joint, not to any specific compliance issues related to the European Union, China or any. Regards
Electronics Forum | Wed Feb 14 16:33:10 EST 2018 | cbart
nope!! i cant think of one!
Electronics Forum | Tue Jan 21 16:28:02 EST 2003 | tony_sauve
Sorry I didn't close this one off last year... We had some failure analysis done on these PCB's ( 3D x-ray,microsectioning,SEM) and the results definitively proved that there was some contamination @ the base of the uvia's that had the voiding. It ap
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