Electronics Forum | Fri Aug 18 03:34:20 EDT 2006 | ridzal
i want to know about some basic details of materials in pcb such as CEM, FR1, FR2, FR3 and XPC.The use, advantages and also disadvantages
Electronics Forum | Fri Aug 18 07:40:32 EDT 2006 | davef
There's a fair amount on the web about this. For instance: http://www.felsweb.com/lam_faq.htm
Electronics Forum | Wed Dec 13 13:42:57 EST 2000 | Mike Ihm
The dielectic absorption characteristic of printed circuit board materials is usually not listed on the manufacturers spec. sheets. Can anyone point me in a direction to help determine which laminate materials might exhibit better dielectric absorpt
Electronics Forum | Tue Aug 22 13:04:04 EDT 2000 | Eugene Smelik
Dr. Lee, Given the higher reflow temperatures for Pb-Free assembly, will common FR4 laminate materials be adequate, or do you believe that higher glass content boards will be required for mainstream Pb-free assembly? As a corollary question - if man
Electronics Forum | Wed Dec 13 20:42:57 EST 2000 | Dave F
Material Dk @ 1GHz tan d @ 1GHz Difunctional 4.40 0.020 Multifunctional 4.43 0.018 Polyimide 4.06 0.006 Cyanate ester 3.65 0.005 Bismaleimide triazine 2.94 0.011 PPO-epoxy 3.85 0.012 PTFE-glass 2.60 0.001 PTFE-mat-CE 2.79 0.003 PTFE-ceramic 4.06 0.00
Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao
according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,
Electronics Forum | Tue Aug 22 16:13:08 EDT 2000 | Dr. Ning-Cheng Lee
FR-4 will be OK for small products such as cellular phones. Here the temperature gradient across the board may be 3-4C only, and the board temperature can be well controlled. At temperature above around 245C, the discoloration and delamination may be
Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef
Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on
Electronics Forum | Tue Oct 07 12:32:39 EDT 2003 | Don Beane
I'm looking for the dielectric values of materials for flex, rigid and flex/rigid pcb construction. Has anyone put together tables for this information? Where can I find the information to figure out what dielectric resistances I need based on altitu
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