Electronics Forum: pcb laser depaneling machines (Page 9 of 11)

Resonator Cracking

Electronics Forum | Fri Nov 16 03:23:15 EST 2007 | jwsmt

I'm requesting assistance in developing detection and containment methods for an issue with an SMD ceramic resonator (Murata CSTCE-G-A family). The returns have external visual cracks that originate at the termination and run at approximately a 45 d

Re: PCB panellisation

Electronics Forum | Fri Apr 03 13:53:41 EST 1998 | Ron Beasley

| | | We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisati

what is the max print speed? thanks for your help

Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika

I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in

Re: Min Hole/Pad distance to edge of PCB

Electronics Forum | Thu Mar 23 14:17:47 EST 2000 | Finepitch Services

Stuart, My suggestion is a DFM meeting (most of the process people dream about a meeting like this, and luckily, I've been to a few) with: - project manager (if there's one) - customer service rep (annual volume, lot size, product life) - smt proce

Re: Min Hole/Pad distance to edge of PCB

Electronics Forum | Thu Mar 23 14:17:47 EST 2000 | Finepitch Services

Stuart, My suggestion is a DFM meeting (most of the process people dream about a meeting like this, and luckily, I've been to a few) with: - project manager (if there's one) - customer service rep (annual volume, lot size, product life) - smt proce

Line release of post reflow AOI and AXI

Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon

You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to

MPA-V or IIIF Users?

Electronics Forum | Thu Mar 22 17:03:59 EST 2001 | williamh

I have been using an MPAV and MVIIF for about 3 1/2 years and have had some difficulties, mainly with the MPAV. After only 2 1/2 years of use we had to replace the laser because we were having alot of QFP's being mismounted. That was an $8,000 expe

Know of anyone using Screen Printer (opposed to Stencil Printer) in SMTA?

Electronics Forum | Sat Apr 15 00:10:52 EDT 2023 | sarason

Having worked in a hybrid maanufacturing operation many years ago, yes stencils are great and have the required accuracy, but on the down side there were 2 operators that were absolute wizzes at turning them out and that could mean up to 20 stencil

Re: problem in micro-BGA assembly

Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff

| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes

IPC-9850

Electronics Forum | Thu Mar 06 16:34:54 EST 2003 | msivigny

Hello gregp, IPC released 9850 on October 22, 2002 after the industry came together to standardize a method to determine placement capability as it relates to placement speed. As I'm sure you are aware, the standard gives placement machine manufactur


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