Electronics Forum | Tue Nov 16 06:52:44 EST 2010 | cacace
1 um". Some PCB manufacturer is telling me that this specification is not feasible in production. I would know if this position is due to the equipment (or process control) they have, or if in effect is not possible to satisfy my requests.
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Fri Jan 14 08:42:47 EST 2005 | Jim Zanolli
We are performing testing for lead free connector finishes. We want to run solderability tests on a series of lead free connector plating options in a series lead free PCB's. I need some advice on the most popular lead free PCB finishes. I am aware
Electronics Forum | Thu Jan 19 21:43:33 EST 2006 | davef
Specifically, what element of the bare board is blistering? Tg of 140 could be acceptable. Search the fine SMTnet Archives for background on decomposition temperature [td]
Electronics Forum | Mon Oct 18 22:15:11 EDT 2004 | KEN
I have two industry leading customers that have specific requirements for components to survive 30 seconds above 230C. In one case I have a custom ASIC that is heat sinked on the die (to the PCB). The sink pulls heat out of the lead frame very effi
Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb
Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4(TG135,TG150,TG170,TG180),Halogen Free FR-4,Ceramic
Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef
There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass
Electronics Forum | Tue Feb 03 03:35:30 EST 2009 | sachu_70
Hi Jose, such a process is possible, but you need to confirm that the PCB material has high Tg. In additon, you need to re-look solder paste printing parameters and make required changes in stencil apperture design for optimum solder volume. Just a
Electronics Forum | Tue Sep 16 20:41:41 EDT 2008 | davef
Q1. Can anyone tell me if there is a procedure for storing raw PCB's? A1. Yes, there are thousands of procedures for storing raw PCB. Why so many? Everyone writes their own procedure. Generally, they say: * Boards require individual separation and p
Electronics Forum | Wed Jan 26 09:51:51 EST 2005 | jbrower
Sure, to be a true lead free enviroment all components need to be lead free or fall within the specifications of lead free as defined by the RoHS Directive. What I am doing is starting stage 1 of our journey. Layed out it looks some thing like this.
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