Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Mon Apr 06 13:59:18 EDT 2009 | wbrenner
For your responce on OrbelE-Z SHIELD. Are you referenceing the PCB pad is 1 to 1 with the fence foot print? Thanks
Electronics Forum | Wed Oct 18 07:51:14 EDT 2006 | davef
Look here: http://www.circuittechctr.com/ As a low cost approach, use copper foil purchased from a stained glass window hobbyist shop. Cut foil pieces to size with a sharp knife. Epoxy the pieces in place of the damaged pads. Tin and then solder th
Electronics Forum | Mon Oct 16 17:46:49 EDT 2006 | Dan
Recently I was given a bad Bios Link from Toshiba which fried my Bios and now my laptop boots to a black screen. I recently unsoldered and removed the existing Bios chip and have ordered anotherfor replacement. Unfortunately while removing, i damag
Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Electronics Forum | Fri Jan 11 14:45:03 EST 2019 | davef
Here's a presentation on IPC-7351C [ http://www.ocipcdc.org/archive/What_is_New_in_IPC-7351C_03_11_2015.pdf ] by Tom Hausherr, CEO & Founder of PCB Libraries, Inc. PCB Libraries helps support SMTnet.com
Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty
Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself
Electronics Forum | Thu Jan 30 06:44:20 EST 2003 | Grant Petty
Hi, Great, thanks for the info! Regards, Grant Petty Blackmagic Design www.blackmagic-design.com
Electronics Forum | Fri Jan 17 15:36:23 EST 2003 | davef
How do 0.5 mm pads on the board help paste release from the stencil? Paste release from the stencil is a function of: * Paste * Printer operation * Stencil design You have no obligation to made your stencil apertures the same size as the pads on yo
Electronics Forum | Fri Jan 17 21:17:18 EST 2003 | Grant Petty
Hi, Our paste release problems have been solved, and we worked on the stencil, and things are working well now. However this board was designed before we knew what was going on, and we thought a little more size on the pads would be a big help. Is
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