Electronics Forum | Sat Jan 19 02:29:11 EST 2002 | ianchan
Thanks for the tips... found out the ex-employee guy, had pre-bake conditioning put into the process flow, as this pcb is made of polymide material, that is reputed to have historical patterns in thermal sensitivity. To avoid "thermal damaging" the
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Fri Jan 18 04:45:32 EST 2002 | wbu
Ianchan, baking as being part of pre-heating is obviously sensless cause the PCB will not maintain any of that heat till soldering. Common reason for prebaking PCB�s is getting the moisture out to prevent outgassing, warpage and maybe other defects.
Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef
There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si
Electronics Forum | Mon Jun 28 09:15:21 EDT 2004 | jdumont
Morning all, we have been seeing some problems with the edges of some of our BGA's curling away from the PCB after reflow. Is this possibly a moisture problem? If so what would be a good time/temp to bake them at to rectify the problem? Thanks in
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
Electronics Forum | Tue May 15 12:14:25 EDT 2001 | brownsj
If the boards are pre-scored, I've used a system called the CAB Maestro which I found to be a very cost effect piece of equipment. www.cabtechn.com Steve.
Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ
Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a
Electronics Forum | Wed May 04 10:42:55 EDT 2005 | nice90
Handling a PCB 1. Check your ESD slippers and ESD Strap first before entering the SMT production line 2. A PCB manufactred over 90 days must be stored first on the baking Oven before Production 3. Temperature on the Baking oven must be 125plus and m
Electronics Forum | Wed Jul 17 15:00:37 EDT 2013 | jmiller
what is the effect of pre-dip tank temp. and dip tank temp. on the thickness of the IAg?
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
