Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef
The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking
Electronics Forum | Wed Jun 24 18:50:31 EDT 2020 | premkumar_haribabu
Dear experts, We are in stage to fix lapse or hold time between pre-bake to reflow process ( SMT ) for flex-rigid PCB, usually for flex pcb , we need to assemble as early as possible once after baking & if not , we can store in humidifier up to some
Electronics Forum | Mon Jul 10 08:17:06 EDT 2017 | philc
Just a random thought, but we had an issue with having to replace faulty LED's on a PCB, and the solution turned out to be pre-baking the LED's prior to build. Just put them in an oven at 40C for 24 hours, then build. Result was zero defective LED's.
Electronics Forum | Mon May 20 16:56:24 EDT 2002 | Gary
Excess slump of paste and mis-registration can cause solder balls along with moisture. Use same date code of pcb and run with no components, paste only. Also pre-bake boards with humidity sensor in oven. If high humidity, moisture and solvent residue
Electronics Forum | Sat Jan 19 02:29:11 EST 2002 | ianchan
Thanks for the tips... found out the ex-employee guy, had pre-bake conditioning put into the process flow, as this pcb is made of polymide material, that is reputed to have historical patterns in thermal sensitivity. To avoid "thermal damaging" the
Electronics Forum | Fri Jan 18 04:45:32 EST 2002 | wbu
Ianchan, baking as being part of pre-heating is obviously sensless cause the PCB will not maintain any of that heat till soldering. Common reason for prebaking PCB�s is getting the moisture out to prevent outgassing, warpage and maybe other defects.
Electronics Forum | Mon Aug 30 06:47:18 EDT 2010 | arjan
We having issues installing the Linear Tech LTM8023. We have different soldering results in our PBfree testruns. The voiding and solderball rate is not stable (random positions and sizes). The pcb's (gold finish)are prebaked, the LGA's are stored in
Electronics Forum | Wed Jul 04 09:58:50 EDT 2012 | daxman
Assuming that you have a saturated moisture-sensitive component: At what temperature would popcorning or internal component damage occur? I would guess that it would be at a temperature where water would boil, around 100 degrees? However, the JEDEC J
Electronics Forum | Fri Feb 24 11:32:29 EST 2006 | inds
In addition to the response from Board House... You WILL see delamination at lead-free temp even during reflow.. more often than not.... sometime manufacturer's try to get aways with it by pre-baking the board to remove moisture..but I think one has
Electronics Forum | Thu May 31 22:35:23 EDT 2012 | jacktan
I have encountered PCB delam issue with high density PCB. PCB has 42 layers , 5 mm thickness ,laminate material is NelcoN4000-13EP,Tg 210C and Td 350C. Have pre-bake at 125 c for 12 hrs before assy.My reflow temp is standard with 243 peak and TAL is
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