Electronics Forum | Fri Sep 22 08:22:17 EDT 2023 | linux
Hello All, This would be a question for someone with experience in PCB design, Intrusive reflow Narrow profile connector(Electrode Rectangular) L=1mm X W=0.9mm. What shape and size hole is required in the PCB to ensure sufficient solderability and re
Electronics Forum | Mon May 19 02:59:04 EDT 2003 | emeto
Hi, I can give you a few steps. 1. The solder paste. Take the profile that manifacturer gives for the paste. 2. Use termocouple to measure the tempereture. Put PCB and measure the temperature in equal terms. 3. Compare your profile to manifacturers
Electronics Forum | Wed Jan 07 02:08:56 EST 2009 | sachu_70
Hi! Just joined the circuit. Hot Bar soldering is very reliable provided the Flexible Printed Circuit (FPC) and Rigid PCB design support this technique. Some of the critical aspects that need to be considered include Stencil apperture design for sold
Electronics Forum | Fri Aug 25 09:12:07 EDT 2006 | russ
When not practical to drill hole into pcb to profile here is what I do and seems to be just fine. place thermo into area underneath BGA and let her rip, you will not be in the ball/solder joint, but the temp difference as long as you are in the arra
Electronics Forum | Tue Nov 05 09:57:45 EST 2013 | cuperpeter
Hello All, We have a problem with dewetting of solder paste. Problem is most visible on the pads without components (see attached pictures) and occurs randomly, 20% of PCB's. Pcb supplier sent us a cross-section of pads with thickness of Cu, Ni and
Electronics Forum | Wed May 12 16:31:25 EDT 2004 | Mark @ SolderStar
In answer to your questions. (1) pls can any body throw some light on the reflow profiling? Reflow profiling is the process of confirming that you PCB's that pass through your reflow oven are produced within specifications provided by solder paste
Electronics Forum | Mon Apr 14 21:43:04 EDT 2008 | joseph_gonzales16
Your problem is process you need to eliminate and there are so many causes to considered. 1.your solder paste 2.your PCB pads 3.your component 4.your profile 5.your printer 6.your placement. you need to isolate all these one of this is your problem.
Electronics Forum | Mon Aug 14 04:00:25 EDT 2017 | sankarseptember
We check the TDK data sheet reflow profile condition. We check the PCB surface temperature the max temperature is 237.Anyhow We will confirm it by check temperature on TDK point
Electronics Forum | Wed Feb 12 08:10:49 EST 2020 | majdi4
We can't do that because we are using dual ligne reflow oven..So the two sides of PCB are soldered with the same reflow profil.
Electronics Forum | Fri Oct 27 08:24:41 EDT 2023 | avaqsemi
When designing a PCB to accommodate an intrusive reflow narrow profile connector (electrode rectangular) with specific dimensions, you'll need to consider the pad size, hole size, and other factors to ensure proper solderability and mechanical stabil
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