Electronics Forum | Wed Apr 19 10:52:29 EDT 2000 | Arturo
Russ: you could divide your 600 in let's say 10 or more categories,category #1 could be the thinnest thickness and smaller board size and smaller components;category #2 thinnest thickness smaller board size and mixed small and big components; and so
Electronics Forum | Fri Oct 29 05:23:00 EDT 1999 | Wolfgang Busko
Hi Bart, that�s much to high. If that would happen to me my boss would tear my head off. For improving the yields you must find the cause for the soldering problems. What are the symptoms? What could be the cause for the symptoms? Could be design pr
Electronics Forum | Wed Mar 04 10:36:10 EST 2009 | milroy
Hi If you mean your PCB stayed in the Reflow oven more than the reflow time required for the solder paste specs then I suggest to throw away the board because it would lead over heated solder joints all over the board. Think what could happen to an
Electronics Forum | Thu Oct 07 22:05:23 EDT 1999 | Dreamsniper
Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. PCB is FR4 Solder Mask is LPI Reflow and W/S Profile = Standard thanks and regards,
Electronics Forum | Tue Dec 07 21:28:00 EST 1999 | sosina outry
I had read all three reply to the interval of pcb in the reflow process already. Like Wolfgang said, base on the profiling and the temp that you set in there. The interval will be base on that temp. Some might have a gap of one pcb lenght, some mig
Electronics Forum | Wed May 24 16:47:22 EDT 2000 | Chris McDonald
I have found that if you have a custom carrier with support between pcbs on both SMT reflows (If you palletize) it will eliminate warping. Also Prebaking PCBS with wieght on the top of them helps too. Also look at the cooldown of your oven profile, y
Electronics Forum | Wed Sep 15 13:55:06 EDT 2004 | dave
Due to some reason there are few balls of the BGA left open during the process. Reflow profile has been verified. There are other BGAs on the PCB and they are fine too. The BGA in question has a very large metal heat sink on top of it and is placed r
Electronics Forum | Mon Jun 27 12:02:47 EDT 2022 | proceng1
I have never used a VP oven, but I did get a pretty good demo of one and was pushing hard for my company to acquire one. The issue ended up being that there was not an East Coast distributor for the "juice" and that became cost prohibitive to get sh
Electronics Forum | Thu Jul 12 21:41:35 EDT 2001 | mugen
A) Questions: 1) What sort of pallet materials used? 2) what PCB thickness & LxW size? 3) what stencil type & thickness used? 4) what profile type used (peak deg-C)? 5) any peak Deg-C contraints for the components SMT onto the PCB? B) We use pallet
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
