Electronics Forum | Fri Sep 09 17:46:11 EDT 2005 | Wild Bill
We are a sub con for a major Electronics firm converting to RoHs WEEE compliancy. they have requested we use Entek on the PCB's. We are having a hard time finding information or a supplier in Asia.
Electronics Forum | Thu Sep 15 19:58:35 EDT 2005 | davef
Shikoku Glicoat SMD process is the market share leader for LF OSP in Japan and the Asian Rim. Enthone Entek is more of a US / Euroland product. Beyond that, it's not clear that Enthone has kept pace with product development necessary to compete in L
Electronics Forum | Thu Jul 26 12:04:16 EDT 2018 | wendymm
RS-274X file contains the complete description of a PCB layer image without requiring any external files. It has all the imaging operators needed for a PCB image. Any aperture shape can be defined as well as positive and negative objects. Maybe that
Electronics Forum | Fri Dec 13 10:05:23 EST 2013 | igorfo
Dears, Could somebody advice is there exist requirements for storing(like humidity , temperature, etc) for PCBA (PCB with SMT components)
Electronics Forum | Fri Jun 05 00:08:32 EDT 2015 | acepa
Hi, I need a recommendation for a manufacturer on a reasonable cost conformal coating (silicone or other). This is a US domestic appliance PCB 9 volts only that must be dipped. Silicone or other could be unused. There is a standard RJ45 socket I wher
Electronics Forum | Wed Jul 25 02:40:24 EDT 2018 | cannizzaro
I have a question about the Gerber file format for PCB prototype. The CAD program I am using is a DOS version and generates Gerber files in the RS-274-D format. However, ALLPCB require the Gerber files in the RS-274-X format. I have to approach other
Electronics Forum | Tue Sep 24 23:02:59 EDT 2002 | redmary
For the COB process, what thickness for plating Au is suitable? IS there any specification for this issue?
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp
I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
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