Electronics Forum | Fri Jul 28 08:08:18 EDT 2006 | Chunks
Screen printer, placement machine(s) and oven. You may also need a hand insertion line, selective solder or wave soldr and some form of electrical test. There are a ton of name brands that no two people can agree on. To get a better feel for what
Electronics Forum | Thu Aug 11 07:01:34 EDT 2011 | franxsmt
Thank you very much for your informative and helpful reply. I have a few more questions:) 1- So for the case 1: should I apply the glue to the PCB with the same method as I apply solder paste? (with screen printer and squeegee). If so, I would guess
Electronics Forum | Thu Aug 11 15:11:35 EDT 2011 | davef
Franx: In response to your follow-up questions ... For the case 1: Q1: Should I apply the glue to the PCB with the same method as I apply solder paste? (with screen printer and squeegee). A1: Correct. Glue can be stencil printed, dispensed, or pin t
Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory
| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T
Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 15:04:18 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 14:57:20 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Wed Apr 15 14:53:06 EDT 1998 | D. Lange
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Mon Apr 13 08:47:09 EDT 1998 | Bob Silveri
| | | | | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no
Electronics Forum | Thu Oct 23 23:38:48 EDT 2008 | pathakvj
We have 8 layer HASL PCB. We saw molten solder blobs / balls on op side of assembled PCB. (to check, if this was a bare board problem), We passed bare board as received thru, SMT reflow oven and saw solder balls on top side of board. What could be th
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