Electronics Forum | Tue Dec 11 19:41:28 EST 2001 | lsjp
Hi there, I am a bit late in answering the question about removing (and probably replacing) those d&%&$Z3 Mictors. Are they straddle mount or vertical? How many segments? What's the configuration of the board (PCB thickness, adjacent components, part
Electronics Forum | Thu Nov 10 15:43:10 EST 2005 | 1st Article
myu, Is using a 0.6mm stencil wise? 42.5 X 42.5 has two models, the 1mm pitch has 41x41 array with 1657 I/O and the 1.27mm pitch has 33x33 with 1088 I/O. For a typical c-cga with 1.0mm - 1.27mm pitch, may requires a 2mil stencil, 1.0mm pitch gets .
Electronics Forum | Thu Sep 14 06:45:11 EDT 2006 | Rob
Hi Mika, We had roughly the same set up - AP27 -CP6x2, GSMx2, VIP98 & we ran the thin boards with durastone routed pallets. If you route out a 0.4mm pocket on the pallet and either use kapton tape/high temp masking tape/ or 3M spraymount to hold
Electronics Forum | Mon Jun 02 15:03:05 EDT 2014 | clydestrum
Background on the PCB: Thickness: .032" Material: Standard Fr4 V-score: Leaves .016" (approx .008" cuts on either side) We are having some issues on these boards where the edges are delaminating all the way to the copper during de-panel. Now, we are
Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef
Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s
Electronics Forum | Tue Jan 14 11:53:44 EST 2020 | avillaro2020
Hi Phil, thanks. I am successful using the same connector on small thinner boards 2-2.5kg) i cant make it work, tried all kinds of profiles with vapour phase but to no avail. Yes you read it right 4.3-6.3mm pcb thickness and 2-2.5Kg. And it is 44 lay
Electronics Forum | Wed Sep 22 09:25:42 EDT 1999 | Wolfgang Busko
| | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the scree
Electronics Forum | Tue Nov 05 09:57:45 EST 2013 | cuperpeter
Hello All, We have a problem with dewetting of solder paste. Problem is most visible on the pads without components (see attached pictures) and occurs randomly, 20% of PCB's. Pcb supplier sent us a cross-section of pads with thickness of Cu, Ni and
Electronics Forum | Mon Dec 20 07:58:02 EST 1999 | pascal MATHIEU
hello guys ; we are using a fine pitch component(0.65mm) on a thick copper PCB (Cu = 90�m) ; in this case we notice that we are in the process'limits , because the different supplier of the PCB are not able to ensure a good stability of it's process
Electronics Forum | Tue Oct 10 13:30:20 EDT 2017 | charliedci
Here is a link to a reflow profile: http://www.aimsolder.com/sites/default/files/reflow_profile_supplement_-_lead-free_solder_paste.pdf Speaking specifically about solder reflow, the process window should be based on the solder paste you are using.
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