Electronics Forum | Thu Jun 17 10:25:43 EDT 1999 | Brian Wycoff
| | We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centr
Electronics Forum | Wed Aug 24 08:43:45 EDT 2005 | PWH
What kind of problems/defects/process indicators are you having? It is likely that you will have to bite the bullet and get a thermal profiling mole to prove that your selected profiles are subjecting parts to the correct tempertures per part specs.
Electronics Forum | Fri Jan 31 10:04:14 EST 2020 | emeto
Jinesh, My initial suggestion is you have too much solder past. Please try to reflow a few of these parts without solder paste. Colse aperture, put some tacky flux on this part location and give it a try. I bet you will not see any voiding.
Electronics Forum | Wed Jul 23 08:18:29 EDT 2008 | davef
Q1. Is this a standard process for plugging? A1. Not as such. We checked both IPC-6012 and IPC-SM-840. Neither comments on plugging. So, your fabrication notes rule the day. Q2. Is this okay for such thick PCB's or is it mandatory to use a special pl
Electronics Forum | Mon Mar 13 13:01:08 EDT 2017 | emeto
Very interesting, how you can answer that with that many details that you gave us. Here are some preliminary questions, before anybody can give you any answer: Pb or Pb-free? 3mil stencil or 8mil stencil? How many shifts? Quantity will depend also o
Electronics Forum | Mon Jul 20 02:35:42 EDT 1998 | Asher Levy
Looking for recommendation, need your on hand experience to decide on narrowing stencil opening relatively to actual pad on pcb for 0603 and 0402 components also info on stencil thickness ? (I have a very dense board with 0603 and 0402 comp.) Thx
Electronics Forum | Fri Oct 08 21:21:21 EDT 1999 | John
Although I can specify it, is ther a way I can test in test (in house)to be sure it's as specified? I don't need it now. I'm thinking of when I will need it. Thanks, John | | Hi, | | | | Does anybody know what is the minimum gold plating thickn
Electronics Forum | Tue Mar 08 02:28:03 EST 2011 | nagesh
I have an issue with PLCC Insufficient Heel solder joint fillet.The aperture dimension is : 30 x 100 mils on PCB & on stencil also(1:1 per gerber).Rohs Process. My stencil thickness is 5mils due to presence of Tssop & QFP package & i cannot increase
Electronics Forum | Wed Feb 26 04:28:39 EST 2014 | chongns
Hi All member I have a problem on the stable down the color of the white solder mask PCB. first, i tough the color differences was cause by the solder mask ink, but after a close look, the color change are cause by the copper under the solder mask
Electronics Forum | Sun Jul 29 23:58:08 EDT 2001 | Frank
Hi Dave Thanks for your information. The problem that I found is paste not stick well on pads ( solder paste printing process). When the table move down (PCB saperate from stencil) some of paste stick on aperture instead pads. Solder paste : Delta
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