Electronics Forum | Thu May 28 07:25:58 EDT 1998 | Earl Moon
| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p
Electronics Forum | Thu May 28 05:43:33 EDT 1998 | Earl Moon
| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz
You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?
Electronics Forum | Mon Feb 21 13:57:37 EST 2005 | JB
Start by verifying the component definition, the thickness is critical. HSP 4796 uses nozzle 81 for 0402's. Make sure is using the right nozzle. If you need to, use the autoteach function to physically teach the dimensions of it, thickness included.
Electronics Forum | Tue Feb 22 12:02:11 EST 2005 | siverts
The first thing to do, as always with any trouble shooting, is to try to isolate your problem area, then it is much easier to pinpoint and find a solution for the problem. Some simple checks you can do, besides the good suggestions you got from some
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Wed Jul 17 12:38:50 EDT 2013 | horchak
It's what the customer wants. remember the customer is always right and that IPC is only recommended guidelines the last time I looked. I also belive IPC shows examples of PTH parts being preped and lap soldered to SMT pads so common sense says what'
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
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