Electronics Forum | Tue Apr 27 13:41:16 EDT 1999 | Scott McKee
| i am trying to design a stencil fixture for manual printing. has anyone done this before or has an idea? thanks | There are sooo many variables; product size, 1 vs. 2 sided boards, support, component size, pitch, stencil alignment, PCB thickness,
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Tue Oct 07 22:15:12 EDT 2014 | padawanlinuxero
How to avoid /reduce warpage in long length PCB & > _1.6MM THICK PCB. You need to put it in a fixture or pallet to run it in the reflow oven, most common material use here is durostone for the pallets that we run in the reflow oven, we use Durosto
Electronics Forum | Tue Oct 07 08:44:49 EDT 2014 | emeto
Hi, 1. I will run the board on the mesh if single sided. 2. For double sided board, I will try stiffeners. 3. If stiffeners don't work, then you have to create a handling fixture(holds the board and has enough openings to let the air flow to the PC
Electronics Forum | Thu Oct 14 23:01:48 EDT 1999 | Dennis O'Donnell
With loaded boards, warpage can be removed by placing the assembly in a wave solder conveyor pallet as you would if you were going to wave solder the assembly. Place board and fixture in a Blue M forced air oven at 90 C for 30 minutes. Let cool to r
Electronics Forum | Mon May 13 23:44:26 EDT 2019 | dami0629
if use tray cannot solve the problem, you can change from the design 1）Reduce the effect of temperature on PCB 2) PCB USE HIGH TG 3) BOARD THICKNESS TOO THIN 4) MODIFY THE BOARD SIZE 5) Reduce the V-CUT depth.
Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz
You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?
Electronics Forum | Fri Dec 17 10:42:58 EST 2010 | hegemon
I believe there is a lot pertinent information in the thread that Dave forwarded... But (IMHO)I think you can look at two things first. First, is your wave solder process friendly to this large PCB, is there enough pre-heat in the board before it h
Electronics Forum | Mon Jan 10 18:22:43 EST 2011 | eadthem
What we use for boards the engineers made to big is aluminum flat bar 1/8 to 1/16 thick about 1 inch wide. we fold it in 1/2 so it fits snuggly on the pcb and just press it on the ends before reflow. id assume the same thing would work on wave but
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