Electronics Forum | Sat Sep 10 17:12:18 EDT 2022 | yannick_herzog
Hello, we use an oven to dry our MSL components after the floor lifes expires. The oven works at 40°C / 0.1% RH. The plan is to upgrade the oven from 40°C to 60°C to shorten the duration of the process. I have found a number of articles mentioning
Electronics Forum | Mon Sep 12 20:24:26 EDT 2022 | stephendo
I'll answer the easy part. If you put low temperature trays in the oven at 120C, they will warp and partially melt. I have seen it more often with reels of LEDs. Someone is told to bake them before use so the put them in the batch oven and the next
Electronics Forum | Tue Sep 13 14:10:13 EDT 2022 | emeto
You can have a dry cabinet with or without heater. They use desiccants to take the humidity out from the parts. As you can imagine it will be a lengthy process. The ones with heater can do 40C, which will be preferred for plastic and paper tapes. I w
Electronics Forum | Thu Sep 15 19:32:51 EDT 2022 | totech
I would like to Add that Mitch is very knowledgeable on this subject, I believe since 2008 this has been a topic of his .. different of low temp baking 40c 50c 60c vs 90c or 125c I do have some totech independent evaluation on the subject if you lik
Electronics Forum | Thu Sep 15 17:44:15 EDT 2022 | decaire
I agree with Evtimov that sticking with the J-Std-033 is preferable to creating your own procedure at a different temp, especially if you need to pass an audit since the auditors will compare your process to the J-Std. My understanding is that oxida
Electronics Forum | Wed Apr 23 07:27:21 EDT 2008 | realchunks
Floor life of a PCB is rated in years. Are you asking about the solder paste or something else?
Electronics Forum | Wed Apr 23 03:19:30 EDT 2008 | jkhiew
Hi all, Can anyone advise me what is the recommended floor life for pcb assembly prior to wave soldering before drying/degassing ? Thks Joseph
Electronics Forum | Mon Jan 05 00:30:07 EST 2004 | Arthur Yang
Hi you there, Do you have any experience upon the shelf life of PCBA which passed 100 cycles of liquid to liquid thermal stress test, 125 to -35 centigrade for 15 minutes and 5 seconds of transfer time from 125 to -35 centigarde. Will apprecia
Electronics Forum | Wed Apr 23 17:28:46 EDT 2008 | davef
The need to prebake boards to remove moisture from the board [to prevent voiding] prior to wave soldering is driven by the thickness of through hole plating. * 1 thou [25um] or greater requires no prebaking * LT 1 thou [25um] requires prebaking
Electronics Forum | Mon Jan 05 18:03:04 EST 2004 | davef
You may struggle finding the information that you seek, because there is so much variability in the design and fabrication of boards. * What is the purpose of such a test? * What product type sees such an use environment? Consider using the guidelin
winsouce.jpg)