Electronics Forum | Mon Jan 05 00:30:07 EST 2004 | Arthur Yang
Hi you there, Do you have any experience upon the shelf life of PCBA which passed 100 cycles of liquid to liquid thermal stress test, 125 to -35 centigrade for 15 minutes and 5 seconds of transfer time from 125 to -35 centigarde. Will apprecia
Electronics Forum | Thu Aug 17 07:53:31 EDT 2000 | Wolfgang Busko
Getting things "foolproof" is sometimes a hard effort and can cost a lot of money. Who is able to tell that it actually saves money instead of wasting it. Transfering responsibility from operators to a system may lead to a somewhat less responsible a
Electronics Forum | Mon Jun 25 03:52:24 EDT 2012 | awtm
Our Customer had detected tarnished pad on ImAg PCBA and had conducted several SEM-EDX test at the soldermask below some of the chip resistors. High concentration of sulfur was found and it can be significantly reduced after further chemical cleaned
Electronics Forum | Fri Jan 11 02:07:08 EST 2002 | ianchan
For repeated model runs, we go ahead with the SMT run, whilst the QA does the FA inspection. Limit FA timing to 2h or less...(simple boards yield faster time cycles). For new model runs, yep, we wait for QA to confirm the FA inspection, only with QA
Electronics Forum | Sat Jun 09 00:53:34 EDT 2001 | ianchan
Hi Folks, My Production runs a uBGA-liken product, and uses Pallets to support the 0.8mm thick pcb, during the SMT + reflow oven process. Process/QA see occurs: 1) 0402 unsolder? 2) 0402 tombstone? 3) "uBGA" poor-visual joints (dry joints)? Took
Electronics Forum | Thu Oct 13 00:18:36 EDT 2011 | kemasta
Hi! We have many PCBA with double side BGA mounted, current practice is to put the board on reflow pallet (durastone 761) to cover BGA at bottom side so that the BGA won't lift after go through reflow oven, but this created 2 problems:- 1) We need t
Electronics Forum | Thu Mar 21 16:50:10 EDT 2019 | emeto
Hello, I've done it before in Excel and it is a very simple concept. Inputs are board size, numbers of SMT and TH process sides, number of SMT and TH placements per side, boards per panel and quantity of boards to be produced. Output will be calcul
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
Electronics Forum | Mon Jan 22 15:51:46 EST 2001 | aiscorp
TransCollaborative Manufacturing software (TCM) is involved in virtually all events flowing from receipt of CAD and BOM data, to procurement of components, to conversion into useful information, and finally to the production of actual product Consid
Electronics Forum | Mon Apr 21 13:48:32 EDT 2003 | davef
ISO 9001-1994 and ISO 9001-2000 are significantly different regarding 'process'. In the 1994 version, processes were considered to be routine manufacturing processes [eg, drill a hole]. In the new ISO, a 'process' is more global and covers anything
.gif)
winsouce.jpg)