Electronics Forum | Fri Jul 27 12:21:18 EDT 2012 | tpatrickwalsh
I am posting this here because I think it may have something to do with PCBA: I have a simple battery-powered consumer product (LED light) that we have been manufacturing for some time. All of a sudden in one batch, we have about a 4% rate of a sing
Electronics Forum | Tue Sep 25 23:09:23 EDT 2018 | franknguyen
Hi, We are PCBA production company which factory's located in Vietnam. Somtime, we have to analyse failure of product to find out the root cause (ex: Micro-crack of solder joint under BGA IC...). We are searching labs around Asia (Vietnam, Malaysia,
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
Electronics Forum | Sat Nov 11 11:27:51 EST 2006 | Tom
Hi, "glass wicking failure" we don't know what this is, but we suspect that the reflow process could very well be the root cause for some of our pcba with micro vias failure. Micro vias pcb we know to well (we don't like them at all). There are No p
Electronics Forum | Wed Oct 14 03:21:37 EDT 2009 | lincy
We found a PCBA performance have insertion loss at the functional test process. We did some analysis and conclude the main root cause is from the PCB performance. What is the critical parameter in PCB will cause a failure in PCBA frequency performan
Electronics Forum | Mon Feb 18 22:05:58 EST 2008 | callckq
Dear All, What is the possible root causes of the dendrite growth? How long its take to cause this dendrite growth? Can dendrite growth cause electrical short? Is there any particular location on PCBA that dendrite tend to grow? Thanks, Sean
Electronics Forum | Wed May 25 21:03:30 EDT 2011 | thanhnguyen22
Hi All, I am new the PCBA process fabrication. I have found many cracks in the PCB after we have cross sections analysis. The cracking has same kind of pattern. It happens betwen the solder and the PCB, or between the solder and the part, BUT not be
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Mon Jun 13 07:20:10 EDT 2011 | scottp
It's more likely the warp is due to material issues. I've spent way more time than I'd care to admit running Thermoire with various profiles and there's pretty much nothing you can do to reduce warp via profile unless your current profile is truly a
Electronics Forum | Sun Jun 27 10:48:46 EDT 2004 | crios
I am a Quality Engineer which went from an Automotive QS9000 company manufacturing ceramic hybrid boards and now I am with a ISO PC mfg. company dealing with PCBA boards. I've been assigned a task in determining the contributing factor to high contam
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