Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz
Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber
Electronics Forum | Thu Jun 08 20:07:32 EDT 2023 | daniel_stanphill
The answer to this lies within the datasheets of the components on the board. Each component has its own specs as far as number of heat cycles, time at reflow, peak temperature, whether it can be washed, etc. You do not need to be as thorough on th
Electronics Forum | Thu Aug 21 21:05:39 EDT 2003 | Tom B
Dan, We, do alot of double reflow. Your right we typically see alot of the standards components, SOT's, SOIC's, Chip stuff. The largest we do with out adding epoxy is some 32pin PLCC's. We have several assemblies were were doing PLCC44's, Sockets
Electronics Forum | Fri Dec 16 10:45:41 EST 2005 | campos
Hi,, My doubt is regarding to the Reflow Time, I mean, in a 5 or 7 zones oves, how long the board should stay inside the oven to complete the soldering cycle? 4 min, more, less...Should I keep low temp until peak for a long time or high temp in shor
Electronics Forum | Thu Feb 20 10:56:49 EST 2003 | larryk
Interesting topic, I got a side bar question. The epoxy companies suggest a lower consistant temp (something like 1 minute at 160 degrees) for curing. But we epoxy and paste our boards that get waved. (I know, why are ya pasting a board that goes t
Electronics Forum | Fri Jun 21 03:07:28 EDT 2019 | gregoryyork
REL alloys from Aim solders maybe worth looking into for this application. May I ask what your profile on reflow is like please, especially peak
Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
Electronics Forum | Fri Mar 07 08:47:45 EST 2003 | msivigny
Hello Peter, In reflow, running a profile and collecting thermal data does not necessarily make it easy to calculate and determine machine capability. On the contrary to your desires of simplifying the process, determining machine capability on an ov
Electronics Forum | Fri May 26 05:54:40 EDT 2000 | Sal
For the past year now we have been printing adhesive with no real problems. Our printing ranges from 0603's to SOIC using a variation of aperture sizes and metal thickness foils. The crucial parameters are : aperture sizes : These obviously depend o
Electronics Forum | Sun May 19 06:43:37 EDT 2002 | xzinxzin
I using water-soluble solder paste, the solder paste recommended, the peak temperature is 215 deg C, the dwell time above 183 deg C is 60-90 sec. **How I can do, the flux in solder paste is active enough to remove the corrosion on the Cu leads to get
