Electronics Forum: peel and force and smt (Page 1 of 2)

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

smt common pad 0402 and 1206 package

Electronics Forum | Fri May 06 08:47:05 EDT 2016 | davef

You're correct. This design will have a record amount of 0402 rework for tombstoning and misalignments. Suggest that the pads on each end of all components be the same size in order to balance wetting forces during reflow.

Pick and placement forces

Electronics Forum | Wed Nov 24 06:24:52 EST 2004 | Joe

Hi, I am an Engineering student doing some research on the component/nozzle interface on SMT Pick and Place machines. Could anyone tell me the force at which the nozzle hits the component as it is picked from the feeder or the placement force on a

Re: IQ/OQ, and PQ

Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F

| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha

Via holes and Wave Solder

Electronics Forum | Tue Mar 07 21:35:16 EST 2006 | Cal Kolokoy

Samir, From experience, the only board test situation where tented via's have difficulty with contact is with a Flying Probe type tester. Otherwise, for traditional ICT, the force of the pogo pins, correct probe type, and fixture design should do th

V-Tek Tape and Reel Machines...

Electronics Forum | Thu Apr 22 13:43:14 EDT 1999 | Steve Gregory

Hey Ya'll! Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)cover t

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

Re: V-Tek Tape and Reel Machines...

Electronics Forum | Sun Apr 25 02:58:58 EDT 1999 | Haim H.

| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c

Re: V-Tek Tape and Reel Machines...

Electronics Forum | Fri Apr 23 17:44:50 EDT 1999 | Stefan Witte

| Hey Ya'll! | | Have any of you ever worked with one of V-Tek's "Economax" tape and reel machines? The biggest thing I'm curious about is the type of cover tape that these machines use. It's something they call P.S.A. (Pressure Sensitive Adhesive)c

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

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